| I-Epoxy Resin Technical Specifications | Indlela yokupakisha | Isicelo | |||||||||||||
| Imodeli | Umbala | Ifomu | Okuqukethwe Okuqinile (%) | EEW (g/eq) | Iphuzu lokuthambisa (℃) | I-Chromaticity (G/H) | I-Viscosity (mPa·s) | I-Hydrolyzable Chlorine (ppm) | Okuqukethwe kwe-Bromine (%) | Okuqukethwe kwe-Phosphorus (%) | Isampula | ||||
| I-Bisphenol F Epoxy Resin | Isixazululo esijwayelekile se-bisphenol F uhlobo lwe-Epoxy resin | EMTE160 | Okungenambala kuya Okuphuzi Okukhanyayo | Uketshezi | - | 155-165 | - | H≤20 | 1200-1600 | ≤150 | - | Isigubhu sensimbi:240kg/drum IBC package: 1000kg ISO tank package:22tons | Izembatho ezingancibiliki, ama-castings, ama-adhesives, insulation materials nezinye izinkambu. | ||
| EMTE170 | Ezingenambala | 165-175 | G≤1 | 3500-4500 | ≤100 |  | |||||||||
| Isixazululo se-bisphenol F esilungisiwe se-Epoxy resin | I-EMTE 207K70 | Okuphuzi Okukhanyayo kuya Kokubomvu Okunsundu | 70±1.0 | 500-600 | G8 | ＜3000 | ＜500 | - | Ukupakishwa kwesigubhu sensimbi: 220Kg. | Amabhodi wesifunda aphrintiwe, ama-laminates e-electronic copper clad, anamathelayo, izinto eziyinhlanganisela, ama-laminate kagesi nezinye izindawo zomkhiqizo. | |||||
