| Abaphakathi & Okukhethekile Resin Imininingwane Yobuchwepheshe | ||||||||||||||||
| Isigaba | Imodeli | Umbala | Ifomu | HAYI (g/eq) | I-Melting Point (℃) | Iphuzu lokuthambisa (℃) | I-Chromaticity (G/H) | I-Cone-Plate Viscosity (P) | I-Phenol yamahhala (ppm) | Ubumsulwa (%) | Isampula | Indlela yokupakisha | Isicelo | |||
| Abalamuli | I-Phenolic Resin | I-Bisphenol A I-Phenolic Resin | EMTP322 | Ayinambala ukuya kokuphuzi Okuphuzi | Okuqinile | - | - | 114-119 | G≤0.8 | 60-90 | ≤2000 | - |  | Isikhwama sephepha esine-PE liner yangaphakathi:25 kg/isikhwama. | Ama-epoxy resin intermediate noma ama-ejenti okwelapha asetshenziswa kakhulu kuma-laminates e-electronic copper clad, ukupakisha kwe-semiconductor nezinye izinkambu. | |
| Isisekelo I-Phenolic Resin | PF-2123 | Okuphuzi Okukhanyayo kuya Kokubomvu Okunsundu | 100-105 | G:12-14 | - | ≤4 |  | Isikhwama sephepha esine-PE liner yangaphakathi:25 kg/isikhwama. Isikhwama sethani: 500kg/isikhwama | Izinto zokubhreka nezinto zokushayisana njengamabhuleki ezitimeleni, izimoto nezithuthuthu, impushana ye-bakelite yemikhiqizo kagesi, izinto zokunamathisela amalambu okukhanya, amasondo okugaya inhlaka kanye nezinto ezikwazi ukumelana nenjoloba ukuze zigaywe futhi zisikwe, izinto zokunamathisela esihlabathini ezibumbayo, izinto ezibamba ilangabi, njll. | |||||||
| i-ortho-Cresol I-Phenolic Resin | EMTP210 | Okuphuzi Okukhanyayo | 113-115 | G≤3 | 35-45 | ＜1000 | - | Isikhwama sephepha esine-PE liner yangaphakathi:25 kg/isikhwama. | Ama-epoxy resin intermediate noma ama-ejenti okwelapha asetshenziswa kakhulu kuma-laminates e-electronic copper clad, ukupakisha kwe-semiconductor nezinye izinkambu. | |||||||
| I-TPN Tetraphenolethane I-Phenolic Resin | EMTP110 | Brown | 90-110 | 135-145 | G≤18 | - | ≤1000 | - | I-epoxy resin ephakathi noma elaphayo. | |||||||
| I-Bisphenol F | EMTP120 | Okumhlophe kuya Kokubomvu Okunsundu | - | ≥105 | - | G＜0.8 | ＜1000 | ≥88 | - | Okumaphakathi okufana ne-low-viscosity epoxy resins, ama-polycarbonate resins, ama-polyphenylene ether resins nama-polyester angagcwele, futhi angasetshenziswa futhi ukuhlanganisa izinto ezivimbela ilangabi, ama-antioxidants kanye nama-plasticizers. | ||||||
| I-DCPD I-Phenolic Resin | EMTP100 | Okubomvu Okunsundu | 150-210 | - | 100-110 | G≤13 | ≤1000 | - | - | I-electronic copper clad laminate nezinye izinkambu. | ||||||
| Imininingwane Yobuchwepheshe ye-EMTD8700 Phosphazene Flame Retardant | ||||||||||||||||
| Isigaba | Imodeli | Umbala | Ifomu | I-Melting Point (℃) | Okuqukethwe Okuguquguqukayo (%) | Td5% (℃) | Okuqukethwe kwe-Phosphorus (%) | Okuqukethwe kwe-nitrogen (%) | Isampula | Indlela yokupakisha | Isicelo | |||||
| I-Phosphazene Flame Retardant | EMTD8700 | Okumhlophe Komhlaba Kuya Kuphuzi Okuphaphile | Okuqinile Impushana | 104-116 | ≤0.5 | ≥330 | ≥13 | ≥6 | - | Isikhwama sephepha esine-PE liner yangaphakathi:25 kg/isikhwama. | Ama-laminates ane-Copper clad, i-electronic potting glue, i-coatings esebenzayo, amaplastiki abushela ilangabi nezinye izimboni. | |||||
| I-Bismaleimide Technical Specifications | ||||||||||||||||
| Isigaba | Imodeli | Umbala | Ifomu | I-Melting Point (℃) | I-Acid Value (mgKOH/g) | Ukuncibilika | Isampula | Indlela yokupakisha | Isicelo | |||||||
| I-Bismaleimide | Ibanga le-Electronic | EMTE505 | Okuphuzi Okuphaphathekile | Okuqinile Impushana | ≥155 | ≤1 | I-Soluble Ngokugcwele | - | Isikhwama sephepha se-kraft esihlanganisiwe esifakwe ifilimu noma ukupakishwa komgqomo wephepha 25kg isikhwama / umgqomo ngamunye. | Izinto zokwakha ze-aerospace, i-carbon fibre high lokushisa ukumelana nezingxenye zesakhiwo, ukushisa okuphezulu ukumelana nopende wokufakelwa, ama-laminates, ama-laminates agqoke ithusi, amapulasitiki abunjiwe, amabhodi wesifunda aphrintiwe aphezulu, izinto ezingagugi, izinto zokunamathisela isondo lokugaya idayimane, izinto kazibuthe, izinsimbi nezinye izinto zokusebenza kanye nezinye izinkambu zobuchwepheshe obuphezulu. | ||||||
| Ibanga likagesi | D929 | Iphaphathekile Okuphuzi-Okumhlophe | ≥155 | ≤1 | I-Soluble Ngokugcwele | - | ||||||||||
